Skip to main content

sureCore Delivers Customised Low Power SRAM for Data Intensive Designs that can deliver up to 70% power savings

New SureFit service customises memory for Imaging, Artificial Intelligence and Machine Learning Applications
 SHEFFIELD, England, March 21, 2019 sureCore Limited’s new SureFit SRAM customization service has delivered low power high capacity SRAM subsystems implemented in advanced FinFET processes to Tier-1 players in the demanding imaging, artificial intelligence and machine learning markets.
The SureFit developed memory system integrates very large memory arrays, delivering high bandwidth, low latency and multi-port capabilities required by these data intensive applications. It builds on sureCore’s patented power saving technology that provides both functional and power optimised memories to deliver unprecedented dynamic and static power savings for multi-megabyte, on-chip SRAM arrays.
unnamed“SureFit memories deliver power efficiencies by coupling custom innovative low power single port memories tiled in an array with energy efficient interconnect and intelligent memory subsystem control. The result is pseudo multi-port operation with minimum area, dynamic power and leakage,” said Paul Wells, CEO.
By engaging with leaders across a broad range of markets, sureCore has developed bespoke solutions tailored to meet precise application demands that have delivered up to 70% power savings.
“AI/ML investments exceeded $19 billion in 2018. A key facet of these applications is the integration of large multi-port SRAMs. For many edge devices, off-the-shelf solutions don’t deliver the necessary power efficiencies. Current customer engagements are a testimony to SureFit’s ability to provide custom, optimised memory solutions tailored to precise specifications,” Wells said.
Delivering competitive and differentiated power efficient solutions means addressing the memory subsystem design. Adopting a bottom-up custom design strategy enables closer alignment with the system architecture resulting in a more power and feature-optimised solution.
Laying out a roadmap for future developments Wells commented that, “We are actively exploring integrating computational elements within the memory subsystem to further increase processing capacities and cut power budgets.”
Delivering competitive products in this space necessitates a holistic approach to system level considerations. As Wells puts it, “Low power SRAM is no longer just low power SRAM!
For additional information, please go to www.sure-core.com


from Electronics Maker https://ift.tt/2Yhtq07

Comments

Popular posts from this blog

TE Connectivity Announced Ultra Small Spring Fingers

TE Connectivity (TE)’snew ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.TE’s ultra small spring fingerscan save valuable PCB space with one of the smallest footprints in the market. Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A). Robust side wall minimizes over- compression. Special anti-lifting design can improve assembly e ciency by locking the tip of the contact within the sidewall of the spring  nger, which helps prevent the contact from getting caught on an operator’s glove during assembly. Pick-and-place area supports auto-assembly processes. It also offered in different heights and styles.As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment …

Hanwha TechwinCollects Two NPI Awards for Its Cutting-Edge Modular Mounter and Screen Printer at APEX

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS(High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ …

Siemens partners with TIES, a Chinese R&D Center to develop new technologies for electric vehicle batteries

Advanced Battery Technology Innovation Center (ABTIC) is initiated jointly by Tianmu Lake Institute of Advanced Energy Storage and Siemens to develop advanced battery technologies and help bring them to volume productionABTIC aims to develop and provide digital solutions for production chains and innovation chains on next generation batteriesSiemens Digital Industries Software has partnered with Tianmu Lake Institute of Advanced Energy Storage Technologies (TIES), a major Chinese energy storage research and development center, to build an Advanced Battery Technology Innovation Center. The Innovation Center, to be located at the 500 million-yuan, 51,000 square meter TIES facility in Liyang, China, will be dedicated to transforming and upgrading the advanced battery industry, including nurturing advanced battery technology research and development, and the development and introduction of high-end talents in this growing area.The Innovation Center will provide the advanced battery innova…