Skip to main content

Electrolube Launch New Encapsulation Resins for the Indian Market

Electrolube_SC4003-LED-Driver-2-copyElectrolube, the leading electro-chemicals and circuit protection specialist, has launched a brand new series of encapsulation resins specifically for the Indian market.  Formulated at the company’s manufacturing facility in Bangalore, the new resins have been produced using local materials to ensure highly competitive pricing and short lead times.  Leveraging group technical support and key local knowledge, Electrolube’s Indian team identified local customers’ requirements in terms of budgetary restraints and production methodologies, and created five cost-effective new resins with higher specifications than existing products on the market. The new encapsulants also carry a full seal of approval from the UK parent company for quality and innovation compliant with internationally recognised standards.

The new resins not only deliver on affordability, but also offer customers excellent, high performance alternatives to existing resin products from brands such as Dow Corning and Elantas. Electrolube’s new silicone encapsulation resins, SC4004 and SC4003, are highly suited for automotive and power supply applications. SC4004, an alternative solution to Dow Corning’s CN-8760, has a high level of thermal conductivity (1.0 W/m.K) enabling efficient heat dissipation and is suitable for wide temperature range – up to +2200C for short excursions of up to 30 minutes. SC4003 has a temperature range of -60 to +2000C (up to +2200C for short excursions of up to 30 minutes) and meets UL94 V-0. Both silicone products feature user friendly 1:1 ratios with the added benefit of fast cure mechanisms at room temperature and are very competitively priced, considering the market’s increasing silicone prices.

The two-part, thermally conductive epoxy encapsulation resins, ER6003 and ER6004, are ideally suited to applications for rectifier regulators, CDI (Capacitor Discharge Ignition), electronic fuel injector circuit potting encapsulation, motor winding applications, cable gland potting and encapsulation of LED driver units. Good flow characteristics also enable effective potting of difficult and complex geometries. ER6003, an effective alternative to  Shimokote 9, offers a broad temperature range from -40 to +1600C (up to +1800C for short excursions of up to 30 minutes) and ER6004 ranges from -40 to +1800C (up to +2000C for short excursions of up to 30 minutes).  ER6004, a viable alternative to CN-8760 and Shimokote 11, is also unique within the family group of epoxy resins as it cures as a softer resin than usual. This feature allows the unit to be reworked or repaired if required, while still offering the same levels of protection.

The silicone modified epoxy resin ER6007 is a repairable black resin mixed in a simple 1:1 ratio. The special characteristics of this encapsulation compound  determine its suitability for LED drivers, power surge protection devices and power supplies. The temperature range is -40 to +1800C (up to +2000C for short excursions of up to 30 minutes) and the thermal conductivity level is 0.66 W/m.K.

Electrolube India’s General Manager, Padmanabha Shaktivelu, comments: “The innovative new resin solutions are a prime example of Electrolube’s dedicated approach to solving problems. With a strong ethos of both research and collaboration, we are continually developing new products, not only to ensure that the product is cost-effective and right for the job, but also to advise and help our customers choose the safest, most appropriate and economical method of application.”

Electrolube India is currently one of the group’s fastest growing subsidiaries and operates as an independent local enterprise with sales, manufacturing and technical support.  For further information about Electrolube’s newest resin solutions, please visit

from Electronics Maker


Popular posts from this blog

TE Connectivity Announced Ultra Small Spring Fingers

TE Connectivity (TE)’snew ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.TE’s ultra small spring fingerscan save valuable PCB space with one of the smallest footprints in the market. Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A). Robust side wall minimizes over- compression. Special anti-lifting design can improve assembly e ciency by locking the tip of the contact within the sidewall of the spring  nger, which helps prevent the contact from getting caught on an operator’s glove during assembly. Pick-and-place area supports auto-assembly processes. It also offered in different heights and styles.As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment …

Hanwha TechwinCollects Two NPI Awards for Its Cutting-Edge Modular Mounter and Screen Printer at APEX

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS(High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ …

Siemens partners with TIES, a Chinese R&D Center to develop new technologies for electric vehicle batteries

Advanced Battery Technology Innovation Center (ABTIC) is initiated jointly by Tianmu Lake Institute of Advanced Energy Storage and Siemens to develop advanced battery technologies and help bring them to volume productionABTIC aims to develop and provide digital solutions for production chains and innovation chains on next generation batteriesSiemens Digital Industries Software has partnered with Tianmu Lake Institute of Advanced Energy Storage Technologies (TIES), a major Chinese energy storage research and development center, to build an Advanced Battery Technology Innovation Center. The Innovation Center, to be located at the 500 million-yuan, 51,000 square meter TIES facility in Liyang, China, will be dedicated to transforming and upgrading the advanced battery industry, including nurturing advanced battery technology research and development, and the development and introduction of high-end talents in this growing area.The Innovation Center will provide the advanced battery innova…