Skip to main content

Infineon and AIC-Sangam to strengthen start-up growth in India

The Partnership will foster start-ups to offer sustainable choices and reduce the impact of Climate Change

Infineon--AICGurugram, India – 28 May 2019 – Infineon Technologies and Atal Innovation Mission’s AIC-Sangam have signed a Memorandum of Understanding (MoU) to nurture technology start-ups with a focus on making lives easier, safer and greener.

Under the collaboration, Infineon will sponsor lab equipment and offer business and technical guidance as well as training specific to building on Infineon technology platforms. Experts from Infineon will work closely with the start-ups on prototyping and solution development at AIC-Sangam. Incubated start-ups will also have access to Infineon’s product samples and maker kits as well as workshops and events. Going forward, AIC-Sangam and Infineon will jointly identify problem statements for prospective start-ups.

Khethworks, one of the start-ups incubated at AIC-Sangam, is already working with Infineon.  Khethworks mission is to help small-plot farmers have unprecedented control over their lives and livelihoods through affordable and high-performance technology.

Speaking on the occasion, Mr. Vinay Shenoy, Managing Director, Infineon Technologies India said, “Infineon’s mission to make life easier, safer and greener resonates well with AIC-Sangam and start-ups like Khethworks. We build semiconductor technology to help innovative entrepreneurs realize their products and unleash the potential of their applications. By contributing towards a sustainable future for India, we are also fulfilling Infineon’s mission.”

Commenting on the partnership with Infineon, Mr. Karthik Chandrasekhar, Co-Founder & Chairman, AIC-Sangam said, “Climate Change is the greatest challenge of our generation. Most of Climate Change is anthropogenic which makes Sangam’s investment in and incubation of entrepreneurial enterprises that are helping customers make more sustainable choices the most meaningful tool to fight Climate Change. We feel this is a shared goal between us and Infineon. We look forward to working closely with Infineon on bringing forward new climate-smart technologies for the Indian consumers or ushering in Industry 4.0 for SMEs that can lead to inclusive development and creation of communities that are resilient to climate change”.

Mr Ramanan Ramanathan, Mission Director, Atal Innovation Mission, NITI Aayog further established the importance of industry and start-up collaborations, stating, “Partnerships between international corporates and our Atal Incubation Centres enable incubated start-ups to accelerate their time to market and extend their industry reach, whilst catalysing innovation by identifying opportunities for new start-ups to be created. Such start-ups bring with them new technologies and processes and this will contribute greatly to India’s growth in the coming years. We are delighted to have Infineon Technologies partner with AIC-Sangam to support start-ups across the clean technology ecosystem.”

AIC-Sangam is India’s first dedicated clean technology incubator, set up as a partnership between Sangam and Atal Innovation Mission, NITI Aayog, Government of India under the Atal Incubation Centre scheme. Infineon had signed a Statement of Intent with NITI Aayog in February 2018, to support the Atal Innovation Mission.Sangam Ventures is leveraging its experience as a venture capitalistto create an ecosystem for clean-tech entrepreneurship to thrive. AIC-Sangam’s team and its acceleration programming is designed to help clean-tech start-ups achieve product-market fit and scale their high impact solutions.

from Electronics Maker


Popular posts from this blog

TE Connectivity Announced Ultra Small Spring Fingers

TE Connectivity (TE)’snew ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.TE’s ultra small spring fingerscan save valuable PCB space with one of the smallest footprints in the market. Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A). Robust side wall minimizes over- compression. Special anti-lifting design can improve assembly e ciency by locking the tip of the contact within the sidewall of the spring  nger, which helps prevent the contact from getting caught on an operator’s glove during assembly. Pick-and-place area supports auto-assembly processes. It also offered in different heights and styles.As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment …

Hanwha TechwinCollects Two NPI Awards for Its Cutting-Edge Modular Mounter and Screen Printer at APEX

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS(High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ …

Siemens partners with TIES, a Chinese R&D Center to develop new technologies for electric vehicle batteries

Advanced Battery Technology Innovation Center (ABTIC) is initiated jointly by Tianmu Lake Institute of Advanced Energy Storage and Siemens to develop advanced battery technologies and help bring them to volume productionABTIC aims to develop and provide digital solutions for production chains and innovation chains on next generation batteriesSiemens Digital Industries Software has partnered with Tianmu Lake Institute of Advanced Energy Storage Technologies (TIES), a major Chinese energy storage research and development center, to build an Advanced Battery Technology Innovation Center. The Innovation Center, to be located at the 500 million-yuan, 51,000 square meter TIES facility in Liyang, China, will be dedicated to transforming and upgrading the advanced battery industry, including nurturing advanced battery technology research and development, and the development and introduction of high-end talents in this growing area.The Innovation Center will provide the advanced battery innova…