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Inspection System S3088 DT Wins Two of the Most Prestigious Prizes in China

Viscom_Pictures_S3088_DT_awards_ChinaHanover, Germany, May 2019 –SMTconnect, Stand 4A-120 – With the S3088 DT, Viscom AG has expanded its diverse range of inspection systems for the electronics industry to include an especially flexible, compact machine for dual-track operation. After a very successful appearance and two awards at Nepcon China, the new alternative to the S6056 will be on display at SMTconnect in Nuremberg, Germany.
The S3088 DT is configured as standard with a dual-track system for use in automatic optical inspection (3D AOI) and confidently claims both one of this year’s “Vision Awards” and an “EM ASIA Innovation Award” in this design. The prizes were awarded at the end of April during the international trade show Nepcon China in Shanghai.
Visitors to SMTconnect in Nuremberg from May 7-9 can experience the advantages of the S3088 DT in person at Viscom’s stand (4A-120). The system features a unique combination of affordability, efficiency, speed and technical performance that meets all the requirements of large-scale mass production today, including,for instance, full connection to state-of-the-art Industry 4.0 interfaces. The S3088 DT ensures reliable inspection of sophisticated 03015 components at an impressive throughput rate.
The system adapts to the varying track widths of the relevant production jobs and can also be used in single-track operation as required. TheS3088 DT then offers the advantage, for example, of being able to inspect even the largest printed circuit boards.
Compared to the S6056 3D AOI system that many Viscom customers use in a dual-track version, the S3088 DT is considerably more compact, particularly with regard to its width. Moreover, the monitor features a fold-out keyboard integrated in the door of the S3088 DT housing to save even more space – an innovative design solution that Viscom introduced in this system.
With regard to its sensor technology, the S3088 DT provides outstanding flexibility: in addition to its configuration for the most sophisticated 3D AOI tasks, configurations for solder paste inspection (3D SPI), conformal coating inspection (CCI) and underfill inspection (UFI) are also available.



from Electronics Maker http://bit.ly/2DVGXBT

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