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TDK Announces Series of New Ultrasonic Sensor Disks
The new devices span applications in both liquid and air-based media.
from All About Circuits Technical Articles https://ift.tt/351nuLN
TE Connectivity (TE)’snew ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.TE’s ultra small spring fingerscan save valuable PCB space with one of the smallest footprints in the market. Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A). Robust side wall minimizes over- compression. Special anti-lifting design can improve assembly e ciency by locking the tip of the contact within the sidewall of the spring nger, which helps prevent the contact from getting caught on an operator’s glove during assembly. Pick-and-place area supports auto-assembly processes. It also offered in different heights and styles.As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment …
Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS(High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ …
Advanced Battery Technology Innovation Center (ABTIC) is initiated jointly by Tianmu Lake Institute of Advanced Energy Storage and Siemens to develop advanced battery technologies and help bring them to volume productionABTIC aims to develop and provide digital solutions for production chains and innovation chains on next generation batteriesSiemens Digital Industries Software has partnered with Tianmu Lake Institute of Advanced Energy Storage Technologies (TIES), a major Chinese energy storage research and development center, to build an Advanced Battery Technology Innovation Center. The Innovation Center, to be located at the 500 million-yuan, 51,000 square meter TIES facility in Liyang, China, will be dedicated to transforming and upgrading the advanced battery industry, including nurturing advanced battery technology research and development, and the development and introduction of high-end talents in this growing area.The Innovation Center will provide the advanced battery innova…