Skip to main content

Analog Devices Introduces Software-Configurable Analog Front End With Integrated ADC for Industrial Process Control Systems

New solution enables designers to create “platform” input modules for multiple product iterations, reducing cost and speeding time-to-market

OCTOBER 31, 2019 — Analog Devices, Inc., today introduced the AD4110-1 Analog Front End with integrated 24-bit ADC for industrial process control systems. AD4110-1 is a universal input AFE with an integrated ADC that allows customers to design a “platform” input module that they can configure for multiple functions. This saves significant R&D cost, reduces time to market and requires less design resources.

  • View the AD4110-1 product page, download the data sheet and order samples: https://ift.tt/2MJOpU3
  • Link to order Evaluation Board: https://ift.tt/2OQVogQ

The high voltage inputs of the AD4110-1 are fully software configurable for current or voltage signals, allowing direct interface to all standard industrial analog signal sources. One reference design replaces many, reducing module size and decreasing cost of ownership. Software-configurable I/O is a key factor in the implementation of Industry 4.0.

The AD4110-1 is available today in 40-lead LFCSP packages. Key features include:

  • Integrated, fully differential programmable gain amplifier (PGA) that offers 16 gain settings from 0.2 to 24
  • Provides internal, front-end diagnostic functions to indicate overvoltage, undervoltage, open wire, overcurrent, and overtemperature conditions.
  • The high voltage input is thermally protected, overcurrent limited, and overvoltage protected.


from Electronics Maker https://ift.tt/2PB0Rsq

Comments

Popular posts from this blog

TE Connectivity Announced Ultra Small Spring Fingers

TE Connectivity (TE)’snew ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.TE’s ultra small spring fingerscan save valuable PCB space with one of the smallest footprints in the market. Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A). Robust side wall minimizes over- compression. Special anti-lifting design can improve assembly e ciency by locking the tip of the contact within the sidewall of the spring  nger, which helps prevent the contact from getting caught on an operator’s glove during assembly. Pick-and-place area supports auto-assembly processes. It also offered in different heights and styles.As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment …

Hanwha TechwinCollects Two NPI Awards for Its Cutting-Edge Modular Mounter and Screen Printer at APEX

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS(High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ …

Siemens partners with TIES, a Chinese R&D Center to develop new technologies for electric vehicle batteries

Advanced Battery Technology Innovation Center (ABTIC) is initiated jointly by Tianmu Lake Institute of Advanced Energy Storage and Siemens to develop advanced battery technologies and help bring them to volume productionABTIC aims to develop and provide digital solutions for production chains and innovation chains on next generation batteriesSiemens Digital Industries Software has partnered with Tianmu Lake Institute of Advanced Energy Storage Technologies (TIES), a major Chinese energy storage research and development center, to build an Advanced Battery Technology Innovation Center. The Innovation Center, to be located at the 500 million-yuan, 51,000 square meter TIES facility in Liyang, China, will be dedicated to transforming and upgrading the advanced battery industry, including nurturing advanced battery technology research and development, and the development and introduction of high-end talents in this growing area.The Innovation Center will provide the advanced battery innova…