Skip to main content

Xilinx Showcases Flexible 5G Communication Platform at IMC2019

We are living in a world with an exploding need for bandwidth where people expect to be connected anywhere, anytime and with the right experience. Only Xilinx’s adaptable communication platforms can deliver the expected user experience in an industry with evolving standards and time to market pressures.  We provide adaptable communication platforms for Wired and Wireless networks, delivering highly integrated, field upgradable, and high-performance solutions from the cloud to radios. 5G is disrupting every aspect of the network infrastructure. To deliver on the full scope of 5G features, standards and performance promises, the wireless networks are going through drastic upgrades and changes.

Xilinx is the engine behind 5G radios and mMIMO deployments. We deliver end-to-end adaptable 5G communication platforms with FPGAs and highly integrated SoCs featuring RF ADC & DACs, and AI/ML acceleration engines. Xilinx technology enables the highest performance and power efficient mMIMO and small cell radios, and paves the path to a more intelligent and autonomous radio access network. We are building the adaptable, intelligent 5G infrastructure. Xilinx’s proven 5G solutions and rich ecosystem offerings enable our customers to deploy fast to market and diverse solutions for 5G NR, converged access, transport, and AI/ML enabled networks. We are building the adaptable, intelligent network infrastructure.

Xilinx along with VVDN Technologies showcased below demos at IMC2019.

  • 400G Solution: Xilinx UltraScale+ portfolio enables scalable networking application in Datacenter, 5G RAN , Fronthaul & core for 1G to 400G. Xilinx with its production ready transceiver is showcasing interface to NextGen 400G big pipe, QSFPDD, OSFP optics.
  • 5G Outdoor Smallcell Solution: Xilinx and VVDN are showcasing 5G small cell application using Zynq UltraScale+ RFSoC  with integrated DFE and L1 stack in the same device. Xilinx is partnering with VVDN to accelerate Operators and OEM Time To Market for 5G applications like small cell solution, Fronthaul as well as Acceleration for Telco DC
  • 5G Fronthaul Solution: Xilinx and VVDN are demonstrating 5G fronthaul termination on Xilinx Alveo U200 Data Center accelerator card  and Vermeo accelerator card. 2 x 25G FH termination with O-RAN 7-2x compliant split is supported along with different compression standards. Each 25G FH can support up to 8 layers of uncompressed IQ streams.
  • RFSoC Technology Demonstration: Xilinx Zynq UltraScale+ RFSoC enables development of 5G application (Radio, Mobile Backhaul, CU/DU)  through its RF-Evaluation tool allowing easy to interface to industry 3GPP & ORAN standard formats.


from Electronics Maker https://ift.tt/2P2VHW3

Comments

Popular posts from this blog

TE Connectivity Announced Ultra Small Spring Fingers

TE Connectivity (TE)’snew ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.TE’s ultra small spring fingerscan save valuable PCB space with one of the smallest footprints in the market. Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A). Robust side wall minimizes over- compression. Special anti-lifting design can improve assembly e ciency by locking the tip of the contact within the sidewall of the spring  nger, which helps prevent the contact from getting caught on an operator’s glove during assembly. Pick-and-place area supports auto-assembly processes. It also offered in different heights and styles.As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment …

Hanwha TechwinCollects Two NPI Awards for Its Cutting-Edge Modular Mounter and Screen Printer at APEX

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS(High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ …

Siemens partners with TIES, a Chinese R&D Center to develop new technologies for electric vehicle batteries

Advanced Battery Technology Innovation Center (ABTIC) is initiated jointly by Tianmu Lake Institute of Advanced Energy Storage and Siemens to develop advanced battery technologies and help bring them to volume productionABTIC aims to develop and provide digital solutions for production chains and innovation chains on next generation batteriesSiemens Digital Industries Software has partnered with Tianmu Lake Institute of Advanced Energy Storage Technologies (TIES), a major Chinese energy storage research and development center, to build an Advanced Battery Technology Innovation Center. The Innovation Center, to be located at the 500 million-yuan, 51,000 square meter TIES facility in Liyang, China, will be dedicated to transforming and upgrading the advanced battery industry, including nurturing advanced battery technology research and development, and the development and introduction of high-end talents in this growing area.The Innovation Center will provide the advanced battery innova…