Skip to main content

Build Your Own Harry Potter Wand with TensorFlow Lite Micro: Low-Power Machine Learning - Micro Vision, Micro Speech and Gesture Recognition

On December 3rd, you will find SparkFun CTO Kirk Bennel and Creative Technologist Rob Reynolds at the AIoT Dev Summit! In collaboration with Ambiq Micro and TensorFlow, we are going to be running a hands-on workshop where you will be able to build your very own Harry Potter wand! That's right, all of us muggles out there can finally get a magic wand without ever having to break into Ollivanders like a certain dark wizard.

AIoT Dev Summit

This is an experiential and experimental workshop that focuses on the use of TensorFlow Lite on a low-power microcontroller to perform machine learning. Modalities covered include word recognition in speech, gesture recognition using accelerometer values, and human presence detection using imagery.

The workshop will cover machine learning model training, deployment and operation, with a majority of time spent on a gesture-recognition activity - “Magic Wand” - that is based on the content of Pete Warden’s forthcoming book, TinyML: Machine Learning with TensorFlow on Arduino and Ultra-Low-Power Microcontrollers.

SparkFun Edge Development Board - Apollo3 Blue

SparkFun Edge Development Board - Apollo3 Blue


All example applications will use the SparkFun Edge Dev Board, which integrates Ambiq Micro’s Apollo3 Blue Arm Cortex-M4F microcontroller, microphones, camera access and on-board low-power management, to deliver a complete package spec’d to run TensorFlow Lite using only 6uA/Mhz. The SparkFun Edge board can run solely on a CR2032 coin cell battery for up to 10 days.

Join Us for the Workshop!

If you can make it, the AIoT Dev Summit is open to everyone - if you register before November 17th you will get a discounted ticket. The conference pulls AI, IoT, and robotic experts for hands-on tech workshops and educational keynotes. Speakers include Simon Segars, CEO of Arm, Mark Spates, Product Lead at Google, Chris Anderson, CEO of 3D Robotics and Massimo Banzi, Co-founder of Arduino. All sessions will be at the Computer History Museum in Mountain View, CA on December 2-3, 2019. Hackster just released a helpful conference overview, here.

comments | comment feed

from SparkFun: Commerce Blog


Popular posts from this blog

TE Connectivity Announced Ultra Small Spring Fingers

TE Connectivity (TE)’snew ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.TE’s ultra small spring fingerscan save valuable PCB space with one of the smallest footprints in the market. Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A). Robust side wall minimizes over- compression. Special anti-lifting design can improve assembly e ciency by locking the tip of the contact within the sidewall of the spring  nger, which helps prevent the contact from getting caught on an operator’s glove during assembly. Pick-and-place area supports auto-assembly processes. It also offered in different heights and styles.As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment …

Hanwha TechwinCollects Two NPI Awards for Its Cutting-Edge Modular Mounter and Screen Printer at APEX

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS(High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ …

Siemens partners with TIES, a Chinese R&D Center to develop new technologies for electric vehicle batteries

Advanced Battery Technology Innovation Center (ABTIC) is initiated jointly by Tianmu Lake Institute of Advanced Energy Storage and Siemens to develop advanced battery technologies and help bring them to volume productionABTIC aims to develop and provide digital solutions for production chains and innovation chains on next generation batteriesSiemens Digital Industries Software has partnered with Tianmu Lake Institute of Advanced Energy Storage Technologies (TIES), a major Chinese energy storage research and development center, to build an Advanced Battery Technology Innovation Center. The Innovation Center, to be located at the 500 million-yuan, 51,000 square meter TIES facility in Liyang, China, will be dedicated to transforming and upgrading the advanced battery industry, including nurturing advanced battery technology research and development, and the development and introduction of high-end talents in this growing area.The Innovation Center will provide the advanced battery innova…