Skip to main content

HID Global and VMware Collaborate to Drive Mass Adoption of Mobile Access to Digital and Physical Workspaces

India, November 6, 2019 – HID Global, a worldwide leader in trusted identity solutions, today announced it is collaborating with VMware to drive mass adoption of mobile access to digital and physical places by adding HID Mobile Access® for opening buildings and doors to VMware Workspace ONE, an intelligence-driven digital workspace platform for managing any app on any device. The collaboration will make it possible for Workspace ONE users, for the first time, to more securely open doors with their smartphones as part of a unified mobile experience that also enables them to access applications, computers, networks, data and cloud-based services.

Workspace ONE is an industry leader in unified endpoint management (UEM) and the collaboration with HID will fuel even broader interest and uptake by enterprise organizations focused on blending physical and digital employee experiences with technology.

 “Adding physical access control capabilities to Workspace ONE will bring a unique element to our customers’ digital transformation journeys as we take yet another step in redefining what it means to provide empowering digital employee experiences across any application on any device,” said Tony Kueh, vice president of product management, End User Computing, VMware.

HID mobile credentials are delivered to Workspace ONE through the HID Origo™ cloud-based access control platform that provides a suite of integration, enablement and developer tools and services that simplify how HID partners and a growing community of new developers and resellers bring mobile access control solutions to market. The platform also streamlines mobile ID replenishment over the air when employees lose or must replace their smartphones and other mobile devices.

“The collaboration between two of the leading companies in the fields of cybersecurity and physical security will help accelerate the use of converged physical and logical access control on mobile devices,” said Hilding Arrehed, Vice President of Cloud Services, Physical Access Control, with HID Global. “The solution underscores HID’s and VMware’s shared commitment to bring to market one of the industry’s first unified access control solution for a user base of this size.”

VMware recently completed a pilot of their platform integration at VMware facilities using Bluetooth-enabled HID iCLASS SE® readers and mobile IDs. The HID Mobile Access application programming interfaces (APIs) and software developer kits (SDKs) provided VMware with direct access to HID access control hardware, speeding integration and pilot execution. The incubation of this technology partnership has validated the benefits of converged physical and logical access control on mobile devices including a more seamless, convenient and intuitive experience for users with improved security and administrative efficiency. Users accessed buildings, rooms and other spaces by tapping their mobile device to a reader at the door, and also unlocked doors from a distance using “twist and go” mobile gesture technology or by simply swiping to unlock their phones as they approached.

Workspace ONE integrates access control, application management and multi-platform endpoint management into a single platform and is available as a cloud service or on-premises deployment. IDC named the platform the 2018 leader in Enterprise Mobility Management and Gartner placed it in its leader quadrant for Unified Endpoint Management (UEM) management tools.

To learn more about HID’s products, go to www.hidglobal.com.

Stay Connected with HID Global

Visit our Media Center, read our Industry Blog, and follow us on Facebook, LinkedIn and Twitter.



from Electronics Maker https://ift.tt/2NNRfYD

Comments

Popular posts from this blog

TE Connectivity Announced Ultra Small Spring Fingers

TE Connectivity (TE)’snew ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.TE’s ultra small spring fingerscan save valuable PCB space with one of the smallest footprints in the market. Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A). Robust side wall minimizes over- compression. Special anti-lifting design can improve assembly e ciency by locking the tip of the contact within the sidewall of the spring  nger, which helps prevent the contact from getting caught on an operator’s glove during assembly. Pick-and-place area supports auto-assembly processes. It also offered in different heights and styles.As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment …

Hanwha TechwinCollects Two NPI Awards for Its Cutting-Edge Modular Mounter and Screen Printer at APEX

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS(High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ …

Siemens partners with TIES, a Chinese R&D Center to develop new technologies for electric vehicle batteries

Advanced Battery Technology Innovation Center (ABTIC) is initiated jointly by Tianmu Lake Institute of Advanced Energy Storage and Siemens to develop advanced battery technologies and help bring them to volume productionABTIC aims to develop and provide digital solutions for production chains and innovation chains on next generation batteriesSiemens Digital Industries Software has partnered with Tianmu Lake Institute of Advanced Energy Storage Technologies (TIES), a major Chinese energy storage research and development center, to build an Advanced Battery Technology Innovation Center. The Innovation Center, to be located at the 500 million-yuan, 51,000 square meter TIES facility in Liyang, China, will be dedicated to transforming and upgrading the advanced battery industry, including nurturing advanced battery technology research and development, and the development and introduction of high-end talents in this growing area.The Innovation Center will provide the advanced battery innova…