Skip to main content

Renesas Electronics Delivers Enhanced Security and Privacy for Bluetooth(R) 5 Connections With 32-Bit RX23W Microcontroller

Provides Full Support Including Long-Range and Mesh Network, and Single-Chip System Control and Wireless Communication

Renesas’ RX23W MCU with Bluetooth 5.0
Renesas’ RX23W MCU with Bluetooth 5.0

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RX23W – a 32-bit microcontroller (MCU) featuring Bluetooth® 5.0 for IoT endpoint devices such as home appliances and healthcare equipment. By combining Bluetooth 5.0 with Renesas’ Trusted Secure IP on its popular high-performance RX MCU family, Renesas offers customers an optimized single-chip solution for system control and wireless communication, while also providing a more secure way to answer the Bluetooth security risks such as eavesdropping, tampering, and viruses.

“While devices with Bluetooth 5.0 Low Energy is not new in the market, Renesas adds value for this ubiquitous wireless technology with a twist: strong emphasis on security and privacy,” said Daryl Khoo, Vice President, Product Marketing, IoT Platform Business Unit at Renesas Electronics Corporation. “The recent security concerns clearly shows that the Bluetooth implementations are getting more complex as more core use cases are defined, and there is a strong need to address better, more secure connections. Renesas believes applications deploying Bluetooth 5.0 Low Energy capabilities will be complemented with our strength in hardware security, all within one MCU that can handle application, communication and security. I am very pleased that Renesas is well positioned to offer this with our flagship RX family which has a proven track record for reliability and safety.”

The new RX23W is based on Renesas’ RXv2 core (Note 1), which provides outstanding computational performance with improved FPU (Note 2) and DSP functions and operates at a maximum clock frequency of 54 MHz. The RX23W provides full Bluetooth® 5.0 Low Energy support including long-range and mesh networking functions and achieves the industry’s lowest level reception mode peak power consumption at 3.0 mA. Furthermore, it integrates a rich set of peripheral functions that are indispensable for IoT equipment, including security, touch key, USB, and CAN functions. These functions allow the RX23W to implement both system control and Bluetooth wireless functions for IoT endpoint equipment such as home appliances, health care equipment, and sports and fitness equipment on a single chip. In addition, the RX23W’s Bluetooth mesh functions make it optimal for industrial IoT equipment collecting sensor data within a factory or a building.

Key Features of the RX23W MCU:

  • Full functional support for Bluetooth 5.0 Low Energy and outstanding reception characteristics
    The RX23W supports long distance communication (long range: 400 m), 2 Mbps (megabit per second) data throughput, and Bluetooth mesh networking, supporting the full functionality of Bluetooth 5.0 Low Energy. Furthermore, the RX23W achieves a 3.0 mA reception mode peak current – the industry’s lowest level – and a reception sensitivity level of -105 dBm at 125 Kbps.
  • A basic protocol stack package and all standard profiles
    In addition to a Bluetooth 5.0 basic protocol stack package, Renesas provides API functions that conform to all standard profiles, including a Health Thermometer Profile (HTP), an Environment Sensing Profile (ESP), and an Automation I/O profile (AIOP). These allow users to start prototype development and evaluation quickly and can speed up the user’s development process.
  • A revolutionary development environment that allows simultaneous development of system control and communication control
    Renesas provides a Smart Configurator, implemented in a GUI, that can generate all types of MCU peripheral function driver code and pin settings for the e2Studio integrated development environment (IDE) to generate the Bluetooth driver code. Renesas also developed a QE for BLE that can generate programs for custom profiles and embed them in user application programs to support application program development. Renesas also developed a Bluetooth Trial Tool Suite that allows users to perform initial wireless characteristics evaluations and Bluetooth functional verification in a GUI. The RX23W target board includes antennas and has already acquired certification under Radio Law. The recommended reference price of this board will be US$55 per unit (excluding tax).
  • Secure communications MCU for the IoT
    The RX23W integrates Renesas’ Trusted Secure IP (TSIP) as part of its built-in hardware security engine. The TSIP driver uses strong encryption key management with hardware accelerators to securely boot customers’ IoT devices and protect them from security threats. Cryptographic Algorithm Validation Program (CVAP) certification is expected.
  • Reduced Bill of Materials through integration
    The RX23W includes a dedicated Bluetooth®high-precision low-speed on-chip oscillator, eliminating the need for external matching circuits and external capacitors. This reduces both BOM (bills of materials) costs and circuit board areas, resulting in lower IoT equipment manufacturing costs.

Pricing and Availability

The RX23W is available now in both 7mm x 7mm 56-pin QFN and 5.5mm x 5.5mm 85-pin GBA packages with 512 KB of on-chip flash memory. For example, the 56-pin QFN package with 512 KB on-chip flash memory will be priced at US$3.83 in 10,000-unit quantities. To learn more about the new Renesas RX23W, visit: https://ift.tt/3647Kau

Note 1: The RX23W includes the RXv2 core, which achieves the high performance of 4.33 Coremark/MHz. Coremark is a benchmark test that the EEMBC (Embedded Microprocessor Benchmark Consortium has specialized for evaluating CPU cores. It is a set of programs written in the C language that perform operations such as data reads and writes, integer calculations, and control operations. The performance value per unit operating frequency is a score using the CC-RX V3 RX family C/C++ compiler.

Note 2: FPU (floating point unit): A function unit that is dedicated to performing floating point calculations.

 



from Electronics Maker https://ift.tt/388gyht

Comments

Popular posts from this blog

TE Connectivity Announced Ultra Small Spring Fingers

TE Connectivity (TE)’snew ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.TE’s ultra small spring fingerscan save valuable PCB space with one of the smallest footprints in the market. Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A). Robust side wall minimizes over- compression. Special anti-lifting design can improve assembly e ciency by locking the tip of the contact within the sidewall of the spring  nger, which helps prevent the contact from getting caught on an operator’s glove during assembly. Pick-and-place area supports auto-assembly processes. It also offered in different heights and styles.As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment …

Hanwha TechwinCollects Two NPI Awards for Its Cutting-Edge Modular Mounter and Screen Printer at APEX

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS(High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ …

Siemens partners with TIES, a Chinese R&D Center to develop new technologies for electric vehicle batteries

Advanced Battery Technology Innovation Center (ABTIC) is initiated jointly by Tianmu Lake Institute of Advanced Energy Storage and Siemens to develop advanced battery technologies and help bring them to volume productionABTIC aims to develop and provide digital solutions for production chains and innovation chains on next generation batteriesSiemens Digital Industries Software has partnered with Tianmu Lake Institute of Advanced Energy Storage Technologies (TIES), a major Chinese energy storage research and development center, to build an Advanced Battery Technology Innovation Center. The Innovation Center, to be located at the 500 million-yuan, 51,000 square meter TIES facility in Liyang, China, will be dedicated to transforming and upgrading the advanced battery industry, including nurturing advanced battery technology research and development, and the development and introduction of high-end talents in this growing area.The Innovation Center will provide the advanced battery innova…